Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
114-91-210-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-91-210-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,108 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-41-308-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-41-308-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,237 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-308-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-91-308-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.
3,860 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-640-T-C Samtec Inc. Sockets for ICs, Transistors

APA-640-T-C

ADAPTER PLUG

Samtec Inc.
2,588 -

RFQ

Bulk APA Active - 40 (2 x 20) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
110-11-310-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-11-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,361 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-11-210-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

121-11-210-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,042 -

RFQ

FudongIC

Datasheet

Tube 121 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-304-61-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,126 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-304-61-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-93-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,502 -

RFQ

Tube * Active - - - - - - - - - - - - - -
115-44-308-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-44-308-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,133 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-41-210-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

111-41-210-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,161 -

RFQ

FudongIC

Datasheet

Tube 111 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-91-210-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

111-91-210-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,406 -

RFQ

FudongIC

Datasheet

Tube 111 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-146-31-018000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

714-43-146-31-018000

CONN SOCKET SIP 46POS GOLD

Mill-Max Manufacturing Corp.
2,545 -

RFQ

FudongIC

Datasheet

Bulk 714 Active SIP 46 (1 x 46) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-11-310-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

210-11-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,508 -

RFQ

FudongIC

Datasheet

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-41-306-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-41-306-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,903 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-11-306-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-11-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,992 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-210-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

123-93-210-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
2,249 -

RFQ

FudongIC

Datasheet

Tube 123 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-43-210-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

123-43-210-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,271 -

RFQ

FudongIC

Datasheet

Tube 123 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-310-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-93-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
2,608 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-310-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,228 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-93-210-31-012000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

714-93-210-31-012000

SOCKET CARRIER DUAL INLINE 10POS

Mill-Max Manufacturing Corp.
3,313 -

RFQ

FudongIC

Datasheet

Tube 714 Active DIP, 0.1 (2.54mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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