Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-91-310-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-91-310-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,788 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-13-210-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

121-13-210-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
3,688 -

RFQ

FudongIC

Datasheet

Tube 121 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-93-210-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-93-210-41-117000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
3,077 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-43-210-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-43-210-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,322 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-210-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-41-210-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,378 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-210-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-210-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,923 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-43-103-41-005000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

317-43-103-41-005000

CONN SKT STRIP

Mill-Max Manufacturing Corp.
3,481 -

RFQ

FudongIC

Datasheet

Tube 317 Active SIP 3 (1 x 3) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-91-102-41-005000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

317-91-102-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.
2,636 -

RFQ

FudongIC

Datasheet

Bulk 317 Active SIP 2 (1 x 2) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-47-306-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-47-306-41-003000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
2,738 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-306-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-47-306-41-006000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
3,781 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
517-87-293-18-101111 Preci-Dip Sockets for ICs, Transistors

517-87-293-18-101111

CONN SOCKET PGA 293POS GOLD

Preci-Dip
2,690 -

RFQ

FudongIC

Datasheet

Bulk 517 Active PGA 293 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
210-99-316-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

210-99-316-41-001000

CONN IC DIP SOCKET 16POS TINLEAD

Mill-Max Manufacturing Corp.
2,109 -

RFQ

FudongIC

Datasheet

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-44-316-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

210-44-316-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
2,476 -

RFQ

FudongIC

Datasheet

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-41-308-41-012000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

146-41-308-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.
2,051 -

RFQ

FudongIC

Datasheet

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-91-308-41-012000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

146-91-308-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.
2,826 -

RFQ

FudongIC

Datasheet

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-210-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-93-210-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
3,977 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-210-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-210-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,409 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-310-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-13-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
3,111 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-47-106-41-005000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

317-47-106-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.
3,330 -

RFQ

FudongIC

Datasheet

Bulk 317 Active SIP 6 (1 x 6) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-6518-10E Aries Electronics Sockets for ICs, Transistors

32-6518-10E

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
3,315 -

RFQ

FudongIC

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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