Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
126-41-308-41-003000

126-41-308-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,715 -

RFQ

126-41-308-41-003000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-308-41-003000

126-91-308-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,714 -

RFQ

126-91-308-41-003000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-93-108-41-005000

317-93-108-41-005000

SHRINK DIP SOCKET 8 PIN

Mill-Max Manufacturing Corp.
2,422 -

RFQ

Tube 317 Active SIP 8 (1 x 8) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
30-0508-20

30-0508-20

CONN SOCKET SIP 30POS GOLD

Aries Electronics
2,970 -

RFQ

30-0508-20

Datasheet

Bulk 508 Active SIP 30 (1 x 30) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
30-0508-30

30-0508-30

CONN SOCKET SIP 30POS GOLD

Aries Electronics
3,584 -

RFQ

30-0508-30

Datasheet

Bulk 508 Active SIP 30 (1 x 30) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
30-1508-20

30-1508-20

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics
3,012 -

RFQ

30-1508-20

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
30-1508-30

30-1508-30

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics
2,304 -

RFQ

30-1508-30

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
28-3513-11H

28-3513-11H

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
2,487 -

RFQ

28-3513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-41-322-41-006000

116-41-322-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,521 -

RFQ

116-41-322-41-006000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-422-41-006000

116-41-422-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,143 -

RFQ

116-41-422-41-006000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-322-41-006000

116-91-322-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,154 -

RFQ

116-91-322-41-006000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-422-41-006000

116-91-422-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,339 -

RFQ

116-91-422-41-006000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-13-320-41-001000

210-13-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
3,234 -

RFQ

210-13-320-41-001000

Datasheet

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-632-41-605000

110-41-632-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,152 -

RFQ

110-41-632-41-605000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-632-41-605000

110-91-632-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,060 -

RFQ

110-91-632-41-605000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-91-120-41-005000

317-91-120-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.
2,845 -

RFQ

317-91-120-41-005000

Datasheet

Bulk 317 Active SIP 20 (1 x 20) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-43-110-41-005000

317-43-110-41-005000

CONN SKT STRIP

Mill-Max Manufacturing Corp.
2,042 -

RFQ

317-43-110-41-005000

Datasheet

Tube 317 Active SIP 10 (1 x 10) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-91-113-41-005000

317-91-113-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.
3,674 -

RFQ

317-91-113-41-005000

Datasheet

Bulk 317 Active SIP 13 (1 x 13) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-93-318-41-012000

146-93-318-41-012000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.
2,246 -

RFQ

146-93-318-41-012000

Datasheet

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-43-318-41-012000

146-43-318-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.
2,209 -

RFQ

146-43-318-41-012000

Datasheet

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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