Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-41-624-41-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-41-624-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,246 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-324-41-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-324-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,015 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-424-41-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-424-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,335 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-624-41-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-624-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,631 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-952-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-47-952-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
2,150 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-316-41-780000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

104-13-316-41-780000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.
2,856 -

RFQ

FudongIC

Datasheet

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
115-41-650-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-41-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,832 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-650-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-91-650-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.
2,590 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-318-41-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-318-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,454 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-320-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-47-320-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
3,501 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-420-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-47-420-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,144 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-41-642-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-41-642-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,216 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-91-642-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-91-642-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,650 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-80-149-15-063101 Preci-Dip Sockets for ICs, Transistors

550-80-149-15-063101

PGA SOLDER TAIL

Preci-Dip
3,600 -

RFQ

FudongIC

Datasheet

Bulk 550 Active PGA 149 (15 x 15) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-93-636-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-93-636-41-003000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.
2,048 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-636-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-43-636-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,444 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-47-640-41-005000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

117-47-640-41-005000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,073 -

RFQ

FudongIC

Datasheet

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-322-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-41-322-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,036 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-422-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-41-422-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,958 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-322-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-91-322-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,682 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Records«Prev1... 397398399400401402403404...1100Next»
Request a Quote
Part Number
Quantity
Contact
Email
Company
Comments
  • FudongIC
    1500+ Daily average RFQ Volume
    FudongIC
    20,000.000 Standard Product Unit
    FudongIC
    1800+ Worldwide Manufacturers
    FudongIC
    15,000+ In-stock Warehouse
    FudongIC

    HOME

    FudongIC

    PRODUCT

    FudongIC

    PHONE

    FudongIC

    USER