Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
111-43-432-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

111-43-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,708 -

RFQ

FudongIC

Datasheet

Tube 111 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
517-87-365-17-091111 Preci-Dip Sockets for ICs, Transistors

517-87-365-17-091111

CONN SOCKET PGA 365POS GOLD

Preci-Dip
2,113 -

RFQ

FudongIC

Datasheet

Bulk 517 Active PGA 365 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-365-14-000111 Preci-Dip Sockets for ICs, Transistors

517-87-365-14-000111

CONN SOCKET PGA 365POS GOLD

Preci-Dip
3,445 -

RFQ

FudongIC

Datasheet

Bulk 517 Active PGA 365 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-93-328-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-93-328-41-105000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
2,882 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-428-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-93-428-41-105000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
2,077 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-628-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-93-628-41-105000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
3,738 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-328-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-43-328-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,461 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-428-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-43-428-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,091 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-628-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-43-628-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,071 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-318-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-93-318-31-007000

SOCKET CARRIER LOWPRO .300 18POS

Mill-Max Manufacturing Corp.
3,081 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-318-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-43-318-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,191 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-41-322-11-480000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

605-41-322-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
2,715 -

RFQ

FudongIC

Datasheet

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-41-422-11-480000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

605-41-422-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
2,002 -

RFQ

FudongIC

Datasheet

Tube 605 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
26-6823-90C Aries Electronics Sockets for ICs, Transistors

26-6823-90C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics
3,864 -

RFQ

FudongIC

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-820-90C Aries Electronics Sockets for ICs, Transistors

26-820-90C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics
3,314 -

RFQ

FudongIC

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-822-90C Aries Electronics Sockets for ICs, Transistors

26-822-90C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics
2,978 -

RFQ

FudongIC

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-823-90C Aries Electronics Sockets for ICs, Transistors

26-823-90C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics
2,948 -

RFQ

FudongIC

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
115-47-648-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

115-47-648-41-003000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
3,805 -

RFQ

FudongIC

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-322-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

123-91-322-41-001000

SOCKET IC OPEN 3 LVL .300 22POS

Mill-Max Manufacturing Corp.
2,180 -

RFQ

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-422-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

123-91-422-41-001000

SOCKET IC OPEN 3 LVL .400 22POS

Mill-Max Manufacturing Corp.
3,487 -

RFQ

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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