Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
123-41-322-41-001000

123-41-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,895 -

RFQ

123-41-322-41-001000

Datasheet

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-422-41-001000

123-41-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,015 -

RFQ

123-41-422-41-001000

Datasheet

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-642-41-105000

110-47-642-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,391 -

RFQ

110-47-642-41-105000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-3508-20

24-3508-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
2,908 -

RFQ

24-3508-20

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-3508-30

24-3508-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
2,369 -

RFQ

24-3508-30

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6508-20

24-6508-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,119 -

RFQ

24-6508-20

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6508-30

24-6508-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
2,489 -

RFQ

24-6508-30

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-47-318-41-001000

116-47-318-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
3,086 -

RFQ

116-47-318-41-001000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-47-648-41-117000

114-47-648-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
3,963 -

RFQ

114-47-648-41-117000

Datasheet

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-320-41-001000

612-41-320-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,557 -

RFQ

612-41-320-41-001000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-420-41-001000

612-41-420-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,894 -

RFQ

612-41-420-41-001000

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-320-41-001000

612-91-320-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,803 -

RFQ

612-91-320-41-001000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-420-41-001000

612-91-420-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,330 -

RFQ

612-91-420-41-001000

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-320-41-001000

126-41-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,244 -

RFQ

126-41-320-41-001000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-420-41-001000

126-41-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,228 -

RFQ

126-41-420-41-001000

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-320-41-001000

126-91-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,407 -

RFQ

126-91-320-41-001000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-420-41-001000

126-91-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,353 -

RFQ

126-91-420-41-001000

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-320-41-008000

116-93-320-41-008000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
2,544 -

RFQ

116-93-320-41-008000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-420-41-008000

116-93-420-41-008000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
2,660 -

RFQ

116-93-420-41-008000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-320-41-008000

116-43-320-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,670 -

RFQ

116-43-320-41-008000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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