Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-43-420-41-008000

116-43-420-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,368 -

RFQ

116-43-420-41-008000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-11-314-41-001000

612-11-314-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,829 -

RFQ

612-11-314-41-001000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-93-318-11-480000

605-93-318-11-480000

SOCKET CARRIER LOWPRO .300 18POS

Mill-Max Manufacturing Corp.
3,040 -

RFQ

605-93-318-11-480000

Datasheet

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-43-318-11-480000

605-43-318-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
2,715 -

RFQ

605-43-318-11-480000

Datasheet

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-210-41-003000

126-93-210-41-003000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
2,453 -

RFQ

126-93-210-41-003000

Datasheet

Tube 126 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-210-41-003000

126-43-210-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,121 -

RFQ

126-43-210-41-003000

Datasheet

Tube 126 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-93-120-41-001000

714-93-120-41-001000

SOCKET CARRIER SIP 20POS

Mill-Max Manufacturing Corp.
3,245 -

RFQ

714-93-120-41-001000

Datasheet

Tube 714 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-432-41-006000

116-47-432-41-006000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,864 -

RFQ

116-47-432-41-006000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-632-41-006000

116-47-632-41-006000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,586 -

RFQ

116-47-632-41-006000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-320-31-002000

614-43-320-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,336 -

RFQ

614-43-320-31-002000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-420-31-002000

614-43-420-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,922 -

RFQ

614-43-420-31-002000

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-320-31-002000

614-93-320-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,604 -

RFQ

614-93-320-31-002000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-420-31-002000

614-93-420-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,252 -

RFQ

614-93-420-31-002000

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-41-652-41-001000

115-41-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,450 -

RFQ

115-41-652-41-001000

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-652-41-001000

115-91-652-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.
3,492 -

RFQ

115-91-652-41-001000

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
30-6503-20

30-6503-20

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics
3,109 -

RFQ

30-6503-20

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-6503-30

30-6503-30

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics
3,069 -

RFQ

30-6503-30

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
317-43-119-41-005000

317-43-119-41-005000

CONN SKT STRIP

Mill-Max Manufacturing Corp.
2,018 -

RFQ

317-43-119-41-005000

Datasheet

Bulk 317 Active SIP 19 (1 x 19) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-318-41-770000

104-13-318-41-770000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.
2,885 -

RFQ

104-13-318-41-770000

Datasheet

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
115-93-636-41-001000

115-93-636-41-001000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.
2,368 -

RFQ

115-93-636-41-001000

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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