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Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
32-3513-11H Aries Electronics Sockets for ICs, Transistors

32-3513-11H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics 		2,323 -

RFQ

FudongIC

Datasheet

 Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
126-93-314-41-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-93-314-41-002000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp. 		2,312 -

RFQ

FudongIC

Datasheet

 Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-314-41-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-43-314-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp. 		2,588 -

RFQ

FudongIC

Datasheet

 Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-318-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-41-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp. 		2,007 -

RFQ

FudongIC

Datasheet

 Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-318-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-91-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp. 		2,268 -

RFQ

FudongIC

Datasheet

 Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
17-0501-21 Aries Electronics Sockets for ICs, Transistors

17-0501-21

CONN SOCKET SIP 17POS GOLD

Aries Electronics 		3,320 -

RFQ

FudongIC

Datasheet

 Bulk 501 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
17-0501-31 Aries Electronics Sockets for ICs, Transistors

17-0501-31

CONN SOCKET SIP 17POS GOLD

Aries Electronics 		3,797 -

RFQ

FudongIC

Datasheet

 Bulk 501 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-0501-20 Aries Electronics Sockets for ICs, Transistors

24-0501-20

CONN SOCKET SIP 24POS TIN

Aries Electronics 		3,024 -

RFQ

FudongIC

Datasheet

 Bulk 501 Active SIP 24 (1 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-0501-30 Aries Electronics Sockets for ICs, Transistors

24-0501-30

CONN SOCKET SIP 24POS TIN

Aries Electronics 		3,728 -

RFQ

FudongIC

Datasheet

 Bulk 501 Active SIP 24 (1 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3503-21 Aries Electronics Sockets for ICs, Transistors

16-3503-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics 		3,570 -

RFQ

FudongIC

Datasheet

 Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3503-31 Aries Electronics Sockets for ICs, Transistors

16-3503-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics 		2,666 -

RFQ

FudongIC

Datasheet

 Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-3503-20 Aries Electronics Sockets for ICs, Transistors

30-3503-20

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics 		2,619 -

RFQ

FudongIC

Datasheet

 Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-3503-30 Aries Electronics Sockets for ICs, Transistors

30-3503-30

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics 		3,097 -

RFQ

FudongIC

Datasheet

 Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-4518-10E Aries Electronics Sockets for ICs, Transistors

24-4518-10E

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics 		3,629 -

RFQ

FudongIC

Datasheet

 Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-93-324-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-93-324-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp. 		2,852 -

RFQ

FudongIC

Datasheet

 Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-424-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-93-424-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp. 		3,376 -

RFQ

FudongIC

Datasheet

 Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-624-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-93-624-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp. 		2,323 -

RFQ

FudongIC

Datasheet

 Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-324-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-324-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp. 		3,485 -

RFQ

FudongIC

Datasheet

 Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-424-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-424-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp. 		2,456 -

RFQ

FudongIC

Datasheet

 Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-624-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-624-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp. 		3,826 -

RFQ

FudongIC

Datasheet

 Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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