Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-91-624-31-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-91-624-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,976 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-322-41-801000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-13-322-41-801000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
3,950 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-3513-11H Aries Electronics Sockets for ICs, Transistors

40-3513-11H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
2,822 -

RFQ

FudongIC

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
612-43-316-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-43-316-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,262 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-316-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-93-316-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,841 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-41-428-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

127-41-428-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,419 -

RFQ

FudongIC

Datasheet

Tube 127 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-41-628-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

127-41-628-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,574 -

RFQ

FudongIC

Datasheet

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-91-428-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

127-91-428-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,610 -

RFQ

FudongIC

Datasheet

Tube 127 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-91-628-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

127-91-628-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,330 -

RFQ

FudongIC

Datasheet

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-11-324-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-11-324-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,818 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-11-424-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-11-424-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,099 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-11-624-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-11-624-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,043 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-41-640-41-005000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

117-41-640-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,919 -

RFQ

FudongIC

Datasheet

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-91-640-41-005000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

117-91-640-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,465 -

RFQ

FudongIC

Datasheet

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-9513-11 Aries Electronics Sockets for ICs, Transistors

40-9513-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
3,568 -

RFQ

FudongIC

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-93-432-41-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-93-432-41-007000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
3,444 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-632-41-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-93-632-41-007000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
2,515 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-432-41-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-432-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,244 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-632-41-007000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-632-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,677 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-13-314-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

122-13-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.
3,651 -

RFQ

FudongIC

Datasheet

Tube 122 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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