Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
111-91-652-41-001000

111-91-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,755 -

RFQ

111-91-652-41-001000

Datasheet

Tube 111 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-324-41-003000

126-41-324-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,087 -

RFQ

126-41-324-41-003000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-424-41-003000

126-41-424-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,168 -

RFQ

126-41-424-41-003000

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-624-41-003000

126-41-624-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,582 -

RFQ

126-41-624-41-003000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-324-41-003000

126-91-324-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,405 -

RFQ

126-91-324-41-003000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-424-41-003000

126-91-424-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,280 -

RFQ

126-91-424-41-003000

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-624-41-003000

126-91-624-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,184 -

RFQ

126-91-624-41-003000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-320-41-001000

612-93-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
2,081 -

RFQ

612-93-320-41-001000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-420-41-001000

612-93-420-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
3,852 -

RFQ

612-93-420-41-001000

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-320-41-001000

612-43-320-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,018 -

RFQ

612-43-320-41-001000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-420-41-001000

612-43-420-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,532 -

RFQ

612-43-420-41-001000

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
16-6503-21

16-6503-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
2,607 -

RFQ

16-6503-21

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-6503-31

16-6503-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
2,440 -

RFQ

16-6503-31

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-0503-21

18-0503-21

CONN SOCKET SIP 18POS GOLD

Aries Electronics
2,379 -

RFQ

18-0503-21

Datasheet

Bulk 0503 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
18-0503-31

18-0503-31

CONN SOCKET SIP 18POS GOLD

Aries Electronics
2,573 -

RFQ

18-0503-31

Datasheet

Bulk 0503 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
612-41-328-41-004000

612-41-328-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,728 -

RFQ

612-41-328-41-004000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-428-41-004000

612-41-428-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,923 -

RFQ

612-41-428-41-004000

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-628-41-004000

612-41-628-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,432 -

RFQ

612-41-628-41-004000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-328-41-004000

612-91-328-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,388 -

RFQ

612-91-328-41-004000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-428-41-004000

612-91-428-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,646 -

RFQ

612-91-428-41-004000

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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