Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-93-328-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-93-328-41-006000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
2,239 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-428-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-93-428-41-006000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
2,002 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-628-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-93-628-41-006000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
3,292 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-328-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-328-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,457 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-428-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-428-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,406 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-628-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-628-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,659 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-328-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-93-328-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
2,078 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-428-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-93-428-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
2,414 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-628-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-93-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
3,837 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-328-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-43-328-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,942 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-428-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-43-428-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,198 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-628-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-43-628-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,165 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-640-31-018000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-41-640-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,232 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-640-31-018000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-91-640-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,666 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-422-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

123-93-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
3,633 -

RFQ

FudongIC

Datasheet

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-322-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

123-93-322-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
2,167 -

RFQ

FudongIC

Datasheet

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-43-322-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

123-43-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,937 -

RFQ

FudongIC

Datasheet

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-11-316-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

612-11-316-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,183 -

RFQ

FudongIC

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-950-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-47-950-41-006000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
2,106 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-636-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-41-636-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,979 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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