Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-93-632-31-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-93-632-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,011 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
21-7438-10 Aries Electronics Sockets for ICs, Transistors

21-7438-10

CONN SOCKET SIP 21POS TIN

Aries Electronics
3,894 -

RFQ

FudongIC

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 21 (1 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
21-7530-10 Aries Electronics Sockets for ICs, Transistors

21-7530-10

CONN SOCKET SIP 21POS TIN

Aries Electronics
2,434 -

RFQ

FudongIC

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 21 (1 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
21-7562-10 Aries Electronics Sockets for ICs, Transistors

21-7562-10

CONN SOCKET SIP 21POS TIN

Aries Electronics
2,491 -

RFQ

FudongIC

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 21 (1 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-6823-90 Aries Electronics Sockets for ICs, Transistors

22-6823-90

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
3,151 -

RFQ

FudongIC

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
26-6823-90T Aries Electronics Sockets for ICs, Transistors

26-6823-90T

CONN IC DIP SOCKET 26POS TIN

Aries Electronics
2,281 -

RFQ

FudongIC

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
116-93-320-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-93-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
3,955 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-420-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-93-420-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
2,929 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-320-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,781 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-420-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,118 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-11-322-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

121-11-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,246 -

RFQ

FudongIC

Datasheet

Tube 121 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-11-422-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

121-11-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,875 -

RFQ

FudongIC

Datasheet

Tube 121 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-114-13-062101 Preci-Dip Sockets for ICs, Transistors

550-10-114-13-062101

PGA SOLDER TAIL

Preci-Dip
2,640 -

RFQ

FudongIC

Datasheet

Bulk 550 Active PGA 114 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
127-41-430-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

127-41-430-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,573 -

RFQ

FudongIC

Datasheet

Tube 127 Active DIP, 0.4 (10.16mm) Row Spacing 30 (2 x 15) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-91-430-41-003000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

127-91-430-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,946 -

RFQ

FudongIC

Datasheet

Tube 127 Active DIP, 0.4 (10.16mm) Row Spacing 30 (2 x 15) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-650-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-93-650-41-105000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.
3,010 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-950-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-93-950-41-105000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.
2,214 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-650-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-43-650-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,037 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-950-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-43-950-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,545 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-652-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-41-652-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,613 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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