Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
126-93-320-41-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-93-320-41-002000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
3,815 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-420-41-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-93-420-41-002000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
2,659 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-320-41-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-43-320-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,851 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-420-41-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

126-43-420-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,276 -

RFQ

FudongIC

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-43-316-41-105000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

117-43-316-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,830 -

RFQ

FudongIC

Datasheet

Tube 117 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-13-424-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

123-13-424-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
2,322 -

RFQ

FudongIC

Datasheet

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-41-964-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-41-964-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,121 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-91-964-41-117000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

114-91-964-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,636 -

RFQ

FudongIC

Datasheet

Tube 114 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-11-648-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-11-648-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,817 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-648-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-93-648-41-006000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.
3,177 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-648-41-006000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

116-43-648-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,434 -

RFQ

FudongIC

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-C182-00 Aries Electronics Sockets for ICs, Transistors

32-C182-00

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
2,638 -

RFQ

FudongIC

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C212-00 Aries Electronics Sockets for ICs, Transistors

32-C212-00

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
3,887 -

RFQ

FudongIC

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C300-00 Aries Electronics Sockets for ICs, Transistors

32-C300-00

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
3,522 -

RFQ

FudongIC

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
122-11-322-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

122-11-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,948 -

RFQ

FudongIC

Datasheet

Tube 122 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-11-422-41-001000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

122-11-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,177 -

RFQ

FudongIC

Datasheet

Tube 122 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-632-41-801000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-93-632-41-801000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
2,038 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-632-41-801000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

110-43-632-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,662 -

RFQ

FudongIC

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-642-31-012000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

614-93-642-31-012000

SOCKET CARRIER LOWPRO .600 42POS

Mill-Max Manufacturing Corp.
3,194 -

RFQ

FudongIC

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-41-642-41-002000 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

127-41-642-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,985 -

RFQ

FudongIC

Datasheet

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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