Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-93-400-20-000003 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-93-400-20-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,017 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 400 (20 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
132-PGM13038-50 Aries Electronics Sockets for ICs, Transistors

132-PGM13038-50

CONN SOCKET PGA GOLD

Aries Electronics
2,392 -

RFQ

- PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-11-256-16-000001 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-11-256-16-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,912 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 256 (16 x 16) 0.100 (2.54mm) - - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-11-256-16-000002 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-11-256-16-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,381 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 256 (16 x 16) 0.100 (2.54mm) - - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-652M35-001166 Preci-Dip Sockets for ICs, Transistors

550-10-652M35-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
2,170 -

RFQ

FudongIC

Datasheet

Bulk 550 Active BGA 652 (35 x 35) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
546-83-503-22-131147 Preci-Dip Sockets for ICs, Transistors

546-83-503-22-131147

CONN SOCKET PGA 503POS GOLD

Preci-Dip
3,708 -

RFQ

FudongIC

Datasheet

Bulk 546 Active PGA 503 (22 x 22) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-296-19-131147 Preci-Dip Sockets for ICs, Transistors

546-83-296-19-131147

CONN SOCKET PGA 296POS GOLD

Preci-Dip
2,029 -

RFQ

FudongIC

Datasheet

Bulk 546 Active PGA 296 (19 x 19) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-420M26-001104 Preci-Dip Sockets for ICs, Transistors

558-10-420M26-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip
3,020 -

RFQ

FudongIC

Datasheet

Bulk 558 Active BGA 420 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
510-13-223-18-095001 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-223-18-095001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,012 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-223-18-095003 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-223-18-095003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,003 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-223-18-098001 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-223-18-098001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,978 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-223-18-098002 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-223-18-098002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,881 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-223-18-098003 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-223-18-098003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,470 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-223-18-095002 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-223-18-095002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,707 -

RFQ

FudongIC

Datasheet

Tube 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
518-77-420M26-001105 Preci-Dip Sockets for ICs, Transistors

518-77-420M26-001105

CONN SOCKET PGA 420POS GOLD

Preci-Dip
3,126 -

RFQ

FudongIC

Datasheet

Bulk 518 Active PGA 420 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
510-13-224-18-095001 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-224-18-095001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,507 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 224 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-224-18-095003 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-224-18-095003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,158 -

RFQ

FudongIC

Datasheet

Bulk 510 Active PGA 224 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-224-18-095002 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-224-18-095002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,268 -

RFQ

FudongIC

Datasheet

Tube 510 Active PGA 224 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
50-9508-21 Aries Electronics Sockets for ICs, Transistors

50-9508-21

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics
2,866 -

RFQ

FudongIC

Datasheet

Bulk 508 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
50-9508-31 Aries Electronics Sockets for ICs, Transistors

50-9508-31

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics
3,527 -

RFQ

FudongIC

Datasheet

Bulk 508 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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