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Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
36-6572-16 Aries Electronics Sockets for ICs, Transistors

36-6572-16

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics 		2,691 -

RFQ

FudongIC

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
224-5809-50-0602 3M Sockets for ICs, Transistors

224-5809-50-0602

3M TEXTOOL ZIP STRIP SOCKETS 224

3M 		2,582 -

RFQ

Box - Active - - - - - - - - - - - - - -
232-2601-50-0602 3M Sockets for ICs, Transistors

232-2601-50-0602

IN-LINE ZIP STRIP POCKETS 32 CON

3M 		2,839 -

RFQ

- - Active - - - - - - - - - - - - - -
514-83-432M31-001148 Preci-Dip Sockets for ICs, Transistors

514-83-432M31-001148

CONN SOCKET BGA 432POS GOLD

Preci-Dip 		2,449 -

RFQ

FudongIC

Datasheet

 Bulk 514 Active BGA 432 (31 x 31) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-320-19-131144 Preci-Dip Sockets for ICs, Transistors

614-83-320-19-131144

CONN SOCKET PGA 320POS GOLD

Preci-Dip 		3,729 -

RFQ

FudongIC

Datasheet

 Bulk 614 Active PGA 320 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-600M35-001166 Preci-Dip Sockets for ICs, Transistors

550-10-600M35-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip 		3,299 -

RFQ

FudongIC

Datasheet

 Bulk 550 Active BGA 600 (35 x 35) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
614-83-321-19-121144 Preci-Dip Sockets for ICs, Transistors

614-83-321-19-121144

CONN SOCKET PGA 321POS GOLD

Preci-Dip 		3,306 -

RFQ

FudongIC

Datasheet

 Bulk 614 Active PGA 321 (21 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-381-18-101135 Preci-Dip Sockets for ICs, Transistors

550-10-381-18-101135

PGA SOLDER TAIL

Preci-Dip 		2,631 -

RFQ

FudongIC

Datasheet

 Bulk 550 Active PGA 381 (18 x 18) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-463-19-101147 Preci-Dip Sockets for ICs, Transistors

546-83-463-19-101147

CONN SOCKET PGA 463POS GOLD

Preci-Dip 		3,240 -

RFQ

FudongIC

Datasheet

 Bulk 546 Active PGA 463 (19 x 19) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-432M31-001152 Preci-Dip Sockets for ICs, Transistors

550-10-432M31-001152

BGA SOLDER TAIL

Preci-Dip 		2,306 -

RFQ

FudongIC

Datasheet

 Bulk 550 Active BGA 432 (31 x 31) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
510-93-361-19-000002 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-93-361-19-000002

SOCKET SOLDERTAIL 361-PGA

Mill-Max Manufacturing Corp. 		3,809 -

RFQ

FudongIC

Datasheet

 Bulk 510 Active PGA 361 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-361-19-000001 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-93-361-19-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp. 		2,128 -

RFQ

FudongIC

Datasheet

 Bulk 510 Active PGA 361 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-361-19-000003 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-93-361-19-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp. 		3,214 -

RFQ

FudongIC

Datasheet

 Bulk 510 Active PGA 361 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-196-14-000001 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-196-14-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp. 		3,686 -

RFQ

FudongIC

Datasheet

 Bulk 510 Active PGA 196 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-196-14-000002 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-196-14-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp. 		2,786 -

RFQ

FudongIC

Datasheet

 Bulk 510 Active PGA 196 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-196-14-000003 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-13-196-14-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp. 		2,873 -

RFQ

FudongIC

Datasheet

 Bulk 510 Active PGA 196 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
558-10-388M26-001104 Preci-Dip Sockets for ICs, Transistors

558-10-388M26-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip 		2,007 -

RFQ

FudongIC

Datasheet

 Bulk 558 Active BGA 388 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
144-PGM12001-51 Aries Electronics Sockets for ICs, Transistors

144-PGM12001-51

CONN SOCKET PGA GOLD

Aries Electronics 		3,416 -

RFQ

FudongIC

Datasheet

 Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
518-77-388M26-001105 Preci-Dip Sockets for ICs, Transistors

518-77-388M26-001105

CONN SOCKET PGA 388POS GOLD

Preci-Dip 		3,061 -

RFQ

FudongIC

Datasheet

 Bulk 518 Active PGA 388 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
510-91-441-21-000001 Mill-Max Manufacturing Corp. Sockets for ICs, Transistors

510-91-441-21-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp. 		3,055 -

RFQ

FudongIC

Datasheet

 Bulk 510 Active PGA 441 (21 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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