Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
1109681-328 Aries Electronics Sockets for ICs, Transistors

1109681-328

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
3,569 -

RFQ

FudongIC

Datasheet

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-624 Aries Electronics Sockets for ICs, Transistors

1109681-624

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
2,168 -

RFQ

FudongIC

Datasheet

Bulk - Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-628 Aries Electronics Sockets for ICs, Transistors

1109681-628

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
2,131 -

RFQ

FudongIC

Datasheet

Bulk - Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-632 Aries Electronics Sockets for ICs, Transistors

1109681-632

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
2,151 -

RFQ

FudongIC

Datasheet

Bulk - Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-648 Aries Electronics Sockets for ICs, Transistors

1109681-648

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics
2,361 -

RFQ

FudongIC

Datasheet

Bulk - Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
69802-452LF Amphenol ICC (FCI) Sockets for ICs, Transistors

69802-452LF

CONN SOCKET PLCC 52POS TIN

Amphenol ICC (FCI)
3,354 -

RFQ

FudongIC

Datasheet

Tube - Obsolete PLCC 52 (4 x 13) 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS)
ASU02DXTB Sullins Connector Solutions Sockets for ICs, Transistors

ASU02DXTB

CONN SOCKET AXIAL 2POS GOLD

Sullins Connector Solutions
3,688 -

RFQ

Tray - Obsolete Axial 2 (Rectangular) - Gold 10.0µin (0.25µm) - Through Hole Board Guide Solder - Gold 10.0µin (0.25µm) - -
54020-68030LF Amphenol ICC (FCI) Sockets for ICs, Transistors

54020-68030LF

CONN SOCKET PLCC 68POS TIN

Amphenol ICC (FCI)
2,377 -

RFQ

FudongIC

Datasheet

Tube - Obsolete PLCC 68 (4 x 17) 0.050 (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyphenylene Sulfide (PPS)
54020-52030LF Amphenol ICC (FCI) Sockets for ICs, Transistors

54020-52030LF

CONN SOCKET PLCC 52POS TIN

Amphenol ICC (FCI)
2,822 -

RFQ

FudongIC

Datasheet

Tube - Obsolete PLCC 52 (4 x 13) 0.050 (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyphenylene Sulfide (PPS)
54020-84030LF Amphenol ICC (FCI) Sockets for ICs, Transistors

54020-84030LF

CONN SOCKET PLCC 84POS TIN

Amphenol ICC (FCI)
2,978 -

RFQ

FudongIC

Datasheet

Tube - Obsolete PLCC 84 (4 x 21) 0.050 (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyphenylene Sulfide (PPS)
A22-LC-TR-R Assmann WSW Components Sockets for ICs, Transistors

A22-LC-TR-R

CONN IC DIP SOCKET 22POS TIN

Assmann WSW Components
2,423 -

RFQ

FudongIC

Datasheet

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
A22-LC-TT Assmann WSW Components Sockets for ICs, Transistors

A22-LC-TT

CONN IC DIP SOCKET 6POS TIN

Assmann WSW Components
3,181 -

RFQ

FudongIC

Datasheet

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT)
AW127-20/Z-T-R Assmann WSW Components Sockets for ICs, Transistors

AW127-20/Z-T-R

SOCKET 20 CONTACTS SINGLE ROW

Assmann WSW Components
2,637 -

RFQ

FudongIC

Datasheet

Bulk - Obsolete - 20 (1 x 20) 0.100 (2.54mm) Nickel 78.7µin (2.00µm) Brass Through Hole - Solder 0.100 (2.54mm) Nickel 78.7µin (2.00µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
AR06-HZW/T-R Assmann WSW Components Sockets for ICs, Transistors

AR06-HZW/T-R

CONN IC DIP SOCKET 6POS TIN

Assmann WSW Components
3,643 -

RFQ

FudongIC

Datasheet

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester, Glass Filled
AR32-HZW/T-R Assmann WSW Components Sockets for ICs, Transistors

AR32-HZW/T-R

CONN IC DIP SOCKET 32POS TIN

Assmann WSW Components
2,302 -

RFQ

FudongIC

Datasheet

Tube - Obsolete DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester, Glass Filled
0475960532 Molex Sockets for ICs, Transistors

0475960532

CONN SOCKET LGA 1156POS GOLD

Molex
2,580 -

RFQ

FudongIC

Datasheet

Tray 47596 Obsolete LGA 1156 (40 x 40) 0.036 (0.91mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Closed Frame Solder 0.036 (0.91mm) - - - Thermoplastic
0475962032 Molex Sockets for ICs, Transistors

0475962032

CONN SOCKET LGA 1155POS

Molex
3,996 -

RFQ

Tray 47596 Obsolete LGA - - - - - - - - - - - - -
0787250002 Molex Sockets for ICs, Transistors

0787250002

CONN CAMERA SOCKET 18POS GOLD

Molex
2,238 -

RFQ

FudongIC

Datasheet

Tray 78725 Obsolete Camera Socket 18 (2 x 9) - Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Closed Frame Solder - Gold Flash Copper Alloy Thermoplastic
1051631001 Molex Sockets for ICs, Transistors

1051631001

SMIA65 CAMERA SOCKET CONTACT

Molex
3,203 -

RFQ

FudongIC

Datasheet

Tape & Reel (TR) 105163 Obsolete Camera Socket 12 (2 x 6) 0.037 (0.95mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount, Through Board Open Frame Solder 0.037 (0.95mm) Gold Flash Copper Alloy Thermoplastic
1051670001 Molex Sockets for ICs, Transistors

1051670001

SMIA65 TOP MNT CAMERA SOCKET

Molex
3,302 -

RFQ

FudongIC

Datasheet

Tape & Reel (TR) 105167 Obsolete Camera Socket 12 (2 x 6) 0.037 (0.95mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder - Gold Flash Copper Alloy Thermoplastic
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