Sockets for ICs, Transistors

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
1051900001 Molex Sockets for ICs, Transistors

1051900001

TOP-MOUNT CAMERA SOCKET FOR SMIA

Molex
2,898 -

RFQ

FudongIC

Datasheet

Tape & Reel (TR) 105190 Obsolete Camera Socket 12 (2 x 6) 0.033 (0.85mm) Gold 12.0µin (0.30µm) Phosphor Bronze Alloy Surface Mount Open Frame Solder 0.033 (0.85mm) Gold Flash Phosphor Bronze Alloy Thermoplastic
1052000001 Molex Sockets for ICs, Transistors

1052000001

SMIA55 CAMERA SOCKET BOTTOM CONT

Molex
2,587 -

RFQ

FudongIC

Datasheet

Tray 105200 Obsolete Camera Socket 12 (2 x 6) 0.028 (0.70mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount, Through Board Open Frame Solder 0.028 (0.70mm) Gold Flash Copper Alloy Thermoplastic
1052000008 Molex Sockets for ICs, Transistors

1052000008

SMIA55 CAMERA SOCKET BOTTOM CONT

Molex
2,242 -

RFQ

FudongIC

Datasheet

Tray 105200 Obsolete Camera Socket 12 (2 x 6) 0.028 (0.70mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount, Through Board Open Frame Solder 0.028 (0.70mm) Gold Flash Copper Alloy Thermoplastic
0784990002 Molex Sockets for ICs, Transistors

0784990002

CONN CAM SOCKET 24POS GOLD

Molex
3,446 -

RFQ

FudongIC

Datasheet

Tape & Reel (TR) 78499 Obsolete Camera Socket 24 (2 x 4, 2 x 8) 0.024 (0.60mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Closed Frame Solder 0.024 (0.60mm) Gold Flash Copper Alloy Plastic
1051990001 Molex Sockets for ICs, Transistors

1051990001

CONN CAM SOCKET 34POS GOLD

Molex
2,507 -

RFQ

FudongIC

Datasheet

Tape & Reel (TR) 105199 Obsolete Camera Socket 34 (2 x 8, 2 x 9) 0.024 (0.60mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Closed Frame Solder 0.024 (0.60mm) - - Copper Alloy Plastic
510-AG92D-10 TE Connectivity AMP Connectors Sockets for ICs, Transistors

510-AG92D-10

CONN SOCKET SIP 10POS TIN-LEAD

TE Connectivity AMP Connectors
2,195 -

RFQ

Bulk - Active SIP 10 (1 x 10) 0.100 (2.54mm) Tin-Lead - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead - Beryllium Copper Thermoplastic
2-382712-1 TE Connectivity AMP Connectors Sockets for ICs, Transistors

2-382712-1

CONN IC DIP SOCKET 16POS TIN

TE Connectivity AMP Connectors
3,453 -

RFQ

FudongIC

Datasheet

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
2-382714-1 TE Connectivity AMP Connectors Sockets for ICs, Transistors

2-382714-1

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors
2,681 -

RFQ

FudongIC

Datasheet

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
2-382719-1 TE Connectivity AMP Connectors Sockets for ICs, Transistors

2-382719-1

CONN IC DIP SOCKET 30POS TIN

TE Connectivity AMP Connectors
3,046 -

RFQ

FudongIC

Datasheet

Tube,Box Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
1939416-1 TE Connectivity AMP Connectors Sockets for ICs, Transistors

1939416-1

CONN SOCKET LGA 1207POS GOLD

TE Connectivity AMP Connectors
3,187 -

RFQ

FudongIC

Datasheet

Tray - Active LGA 1207 (33 x 34) 0.043 (1.09mm) Gold - Beryllium Copper Surface Mount Closed Frame Solder 0.043 (1.09mm) - - - Thermoplastic
1939416-2 TE Connectivity AMP Connectors Sockets for ICs, Transistors

1939416-2

CONN SOCKET LGA 1207POS GOLD

TE Connectivity AMP Connectors
2,799 -

RFQ

FudongIC

Datasheet

Tray - Active LGA 1207 (33 x 34) 0.043 (1.09mm) Gold - Beryllium Copper Surface Mount Closed Frame Solder 0.043 (1.09mm) - - - Thermoplastic
524-AG11D TE Connectivity AMP Connectors Sockets for ICs, Transistors

524-AG11D

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
2,433 -

RFQ

FudongIC

Datasheet

Tube 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Polyester
814-AG11D TE Connectivity AMP Connectors Sockets for ICs, Transistors

814-AG11D

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors
3,769 -

RFQ

FudongIC

Datasheet

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester
814-AG11D-ES TE Connectivity AMP Connectors Sockets for ICs, Transistors

814-AG11D-ES

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors
3,545 -

RFQ

FudongIC

Datasheet

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester
818-AG11D-ESL TE Connectivity AMP Connectors Sockets for ICs, Transistors

818-AG11D-ESL

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors
2,420 -

RFQ

FudongIC

Datasheet

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester
TDU02DXTB Sullins Connector Solutions Sockets for ICs, Transistors

TDU02DXTB

TEST SOCKET

Sullins Connector Solutions
3,464 -

RFQ

Bulk - Active Axial 2 (Rectangular) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Board Guide Solder 0.150 (3.81mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS)
2174988-1 TE Connectivity AMP Connectors Sockets for ICs, Transistors

2174988-1

CONN SOCKET LGA 2011POS GOLD

TE Connectivity AMP Connectors
2,061 -

RFQ

FudongIC

Datasheet

Bulk - Last Time Buy LGA 2011 (47 x 58) 0.040 (1.02mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Closed Frame Solder 0.035 (0.90mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic
2040636-1 TE Connectivity AMP Connectors Sockets for ICs, Transistors

2040636-1

CONN SOCKET LGA 1567POS GOLD

TE Connectivity AMP Connectors
3,912 -

RFQ

FudongIC

Datasheet

Tray,Box - Obsolete LGA 1567 0.040 (1.02mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039 (1.00mm) - - Copper Alloy Thermoplastic
2134146-2 TE Connectivity AMP Connectors Sockets for ICs, Transistors

2134146-2

CONN SOCKET PGA 989POS GOLD

TE Connectivity AMP Connectors
3,379 -

RFQ

FudongIC

Datasheet

Tape & Reel (TR),Cut Tape (CT),Box - Obsolete PGA 989 (35 x 36) 0.157 (4.00mm) Gold Flash Copper Alloy Surface Mount Open Frame Solder 0.157 (4.00mm) Tin-Lead Flash Copper Alloy Thermoplastic
XR2C2611N Omron Electronics Inc-EMC Div Sockets for ICs, Transistors

XR2C2611N

CONN SOCKET SIP 26POS GOLD

Omron Electronics Inc-EMC Div
3,156 -

RFQ

FudongIC

Datasheet

Bulk XR2 Active SIP 26 (1 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
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