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BSP78 E6327 Infineon Technologies

Part No.:: BSP78 E6327

Manufacturer:: Infineon Technologies

Category:: PMIC - Power Distribution Switches, Load Drivers

Package:: PG-SOT223-4

Datasheet:: BSP78 E6327.pdf

Description:: IC PWR SWTCH N-CHAN 1:1 SOT223-4

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:$1.090000

Total:$1.090000

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Application Scenarios

What Applications Is BSP78 E6327 Suitable For?

BSP78 E6327 is a PMIC - Power Distribution Switches, Load Drivers product from Infineon Technologies, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable PMIC - Power Distribution Switches, Load Drivers components. Engineers can review the BSP78 E6327 datasheet, package PG-SOT223-4 and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Infineon Technologies components are required, helping engineers evaluate BSP78 E6327 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the BSP78 E6327 description, package PG-SOT223-4 and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports BSP78 E6327 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for BSP78 E6327 Pricing & Technical Support

Product Overview

BSP78 E6327 is a PMIC - Power Distribution Switches, Load Drivers product from Infineon Technologies. It is supplied in package PG-SOT223-4 and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide BSP78 E6327 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC PWR SWTCH N-CHAN 1:1 SOT223-4

Key Features

Part Number:BSP78 E6327
Manufacturer:Infineon Technologies
Category:PMIC - Power Distribution Switches, Load Drivers
Package:PG-SOT223-4
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

BSP78 E6327 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for BSP78 E6327 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Digi-Reel®
Series:

HITFET®
ProductStatus:

Obsolete
SwitchType:

General Purpose
NumberofOutputs:

1
Ratio-Input:Output:

1:1
OutputConfiguration:

Low Side
OutputType:

N-Channel
Interface:

On/Off
Voltage-Load:

42V (Max)
Voltage-Supply(Vcc/Vdd):

Not Required
Current-Output(Max):

3A
RdsOn(Typ):

35mOhm
InputType:

Non-Inverting
Features:

Auto Restart
FaultProtection:

Current Limiting (Fixed), Over Temperature, Over Voltage
OperatingTemperature:

-40°C ~ 150°C (TJ)
MountingType:

Surface Mount
Category:

PMIC - Power Distribution Switches, Load Drivers
Datasheet:

BSP78 E6327.pdf

BSP78 E6327 Frequently Asked Questions

Is BSP78 E6327 currently in stock? ▼

FudongIC currently shows 0 units of BSP78 E6327 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for BSP78 E6327? ▼

The minimum order quantity currently shown for BSP78 E6327 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is BSP78 E6327 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for BSP78 E6327, please note this in your RFQ.

Can you provide a datasheet or technical support for BSP78 E6327? ▼

Yes. You can view or download the BSP78 E6327.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for BSP78 E6327, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for BSP78 E6327? ▼

Yes. Based on your application, preferred manufacturer, package PG-SOT223-4, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for BSP78 E6327. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use BSP78 E6327? ▼

As a PMIC - Power Distribution Switches, Load Drivers product from Infineon Technologies, BSP78 E6327 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.