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BV1LB028FPJ-CE1 Rohm Semiconductor

Part No.:: BV1LB028FPJ-CE1

Manufacturer:: Rohm Semiconductor

Category:: PMIC - Power Distribution Switches, Load Drivers

Package:: TO252-J3

Datasheet:: BV1LB028FPJ-CE1.pdf

Description:: BV1LB028FPJ-C IS AN AUTOMOTIVE 1

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is BV1LB028FPJ-CE1 Suitable For?

BV1LB028FPJ-CE1 is a PMIC - Power Distribution Switches, Load Drivers product from Rohm Semiconductor, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable PMIC - Power Distribution Switches, Load Drivers components. Engineers can review the BV1LB028FPJ-CE1 datasheet, package TO252-J3 and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Rohm Semiconductor components are required, helping engineers evaluate BV1LB028FPJ-CE1 specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the BV1LB028FPJ-CE1 description, package TO252-J3 and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports BV1LB028FPJ-CE1 datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for BV1LB028FPJ-CE1 Pricing & Technical Support

Product Overview

BV1LB028FPJ-CE1 is a PMIC - Power Distribution Switches, Load Drivers product from Rohm Semiconductor. It is supplied in package TO252-J3 and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide BV1LB028FPJ-CE1 datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: BV1LB028FPJ-C IS AN AUTOMOTIVE 1

Key Features

Part Number:BV1LB028FPJ-CE1
Manufacturer:Rohm Semiconductor
Category:PMIC - Power Distribution Switches, Load Drivers
Package:TO252-J3
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

BV1LB028FPJ-CE1 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for BV1LB028FPJ-CE1 stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

Automotive, AEC-Q100
ProductStatus:

Active
SwitchType:

General Purpose
NumberofOutputs:

1
Ratio-Input:Output:

1:1
OutputConfiguration:

Low Side
OutputType:

N-Channel
Interface:

-
Voltage-Load:

3V ~ 5.5V
Voltage-Supply(Vcc/Vdd):

Not Required
Current-Output(Max):

40A
RdsOn(Typ):

28mOhm
InputType:

Non-Inverting
Features:

Slew Rate Controlled
FaultProtection:

Current Limiting (Fixed), Over Temperature
OperatingTemperature:

-40°C ~ 150°C (TJ)
MountingType:

Surface Mount
Category:

PMIC - Power Distribution Switches, Load Drivers
Datasheet:

BV1LB028FPJ-CE1.pdf

BV1LB028FPJ-CE1 Frequently Asked Questions

Is BV1LB028FPJ-CE1 currently in stock? ▼

FudongIC currently shows 3,694 units of BV1LB028FPJ-CE1 in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for BV1LB028FPJ-CE1? ▼

The minimum order quantity currently shown for BV1LB028FPJ-CE1 is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is BV1LB028FPJ-CE1 original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for BV1LB028FPJ-CE1, please note this in your RFQ.

Can you provide a datasheet or technical support for BV1LB028FPJ-CE1? ▼

Yes. You can view or download the BV1LB028FPJ-CE1.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for BV1LB028FPJ-CE1, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for BV1LB028FPJ-CE1? ▼

Yes. Based on your application, preferred manufacturer, package TO252-J3, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for BV1LB028FPJ-CE1. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use BV1LB028FPJ-CE1? ▼

As a PMIC - Power Distribution Switches, Load Drivers product from Rohm Semiconductor, BV1LB028FPJ-CE1 may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.