All Categories

View More Product Categories >>

RT3PE600L-CG484PROTO Microsemi Corporation

Part No.:: RT3PE600L-CG484PROTO

Manufacturer:: Microsemi Corporation

Category:: Embedded - FPGAs (Field Programmable Gate Array)

Package:: 484-BFCPGA

Datasheet:: RT3PE600L-CG484PROTO.pdf

Description:: IC FPGA 270 I/O 484CCGA

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

Payment:

Shipping:

Application Scenarios

What Applications Is RT3PE600L-CG484PROTO Suitable For?

RT3PE600L-CG484PROTO is a Embedded - FPGAs (Field Programmable Gate Array) product from Microsemi Corporation, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - FPGAs (Field Programmable Gate Array) components. Engineers can review the RT3PE600L-CG484PROTO datasheet, package 484-BFCPGA and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Microsemi Corporation components are required, helping engineers evaluate RT3PE600L-CG484PROTO specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the RT3PE600L-CG484PROTO description, package 484-BFCPGA and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports RT3PE600L-CG484PROTO datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for RT3PE600L-CG484PROTO Pricing & Technical Support

Product Overview

RT3PE600L-CG484PROTO is a Embedded - FPGAs (Field Programmable Gate Array) product from Microsemi Corporation. It is supplied in package 484-BFCPGA and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide RT3PE600L-CG484PROTO datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC FPGA 270 I/O 484CCGA

Key Features

Part Number:RT3PE600L-CG484PROTO
Manufacturer:Microsemi Corporation
Category:Embedded - FPGAs (Field Programmable Gate Array)
Package:484-BFCPGA
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

RT3PE600L-CG484PROTO may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for RT3PE600L-CG484PROTO stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

484-BFCPGA
Packaging:

Box
Series:

ProASIC3
ProductStatus:

Active
NumberofLABs/CLBs:

-
NumberofLogicElements/Cells:

-
TotalRAMBits:

110592
NumberofI/O:

270
NumberofGates:

600000
Voltage-Supply:

1.425V ~ 1.575V
MountingType:

Through Hole
OperatingTemperature:

-55°C ~ 125°C (TJ)
Category:

Embedded - FPGAs (Field Programmable Gate Array)
Datasheet:

RT3PE600L-CG484PROTO.pdf

RT3PE600L-CG484PROTO Frequently Asked Questions

Is RT3PE600L-CG484PROTO currently in stock? ▼

FudongIC currently shows 3,107 units of RT3PE600L-CG484PROTO in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for RT3PE600L-CG484PROTO? ▼

The minimum order quantity currently shown for RT3PE600L-CG484PROTO is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is RT3PE600L-CG484PROTO original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for RT3PE600L-CG484PROTO, please note this in your RFQ.

Can you provide a datasheet or technical support for RT3PE600L-CG484PROTO? ▼

Yes. You can view or download the RT3PE600L-CG484PROTO.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for RT3PE600L-CG484PROTO, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for RT3PE600L-CG484PROTO? ▼

Yes. Based on your application, preferred manufacturer, package 484-BFCPGA, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for RT3PE600L-CG484PROTO. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use RT3PE600L-CG484PROTO? ▼

As a Embedded - FPGAs (Field Programmable Gate Array) product from Microsemi Corporation, RT3PE600L-CG484PROTO may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.