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XCV600-5BG560C AMD Xilinx

Part No.:: XCV600-5BG560C

Manufacturer:: AMD Xilinx

Category:: Embedded - FPGAs (Field Programmable Gate Array)

Package:: 560-LBGA Exposed Pad, Metal

Datasheet:: XCV600-5BG560C.pdf

Description:: IC FPGA 404 I/O 560MBGA

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Application Scenarios

What Applications Is XCV600-5BG560C Suitable For?

XCV600-5BG560C is a Embedded - FPGAs (Field Programmable Gate Array) product from AMD Xilinx, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - FPGAs (Field Programmable Gate Array) components. Engineers can review the XCV600-5BG560C datasheet, package 560-LBGA Exposed Pad, Metal and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original AMD Xilinx components are required, helping engineers evaluate XCV600-5BG560C specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the XCV600-5BG560C description, package 560-LBGA Exposed Pad, Metal and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports XCV600-5BG560C datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for XCV600-5BG560C Pricing & Technical Support

Product Overview

XCV600-5BG560C is a Embedded - FPGAs (Field Programmable Gate Array) product from AMD Xilinx. It is supplied in package 560-LBGA Exposed Pad, Metal and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide XCV600-5BG560C datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC FPGA 404 I/O 560MBGA

Key Features

Part Number:XCV600-5BG560C
Manufacturer:AMD Xilinx
Category:Embedded - FPGAs (Field Programmable Gate Array)
Package:560-LBGA Exposed Pad, Metal
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

XCV600-5BG560C may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for XCV600-5BG560C stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

560-LBGA Exposed Pad, Metal
Packaging:

Tray
Series:

Virtex®
ProductStatus:

Obsolete
NumberofLABs/CLBs:

3456
NumberofLogicElements/Cells:

15552
TotalRAMBits:

98304
NumberofI/O:

404
NumberofGates:

661111
Voltage-Supply:

2.375V ~ 2.625V
MountingType:

Surface Mount
OperatingTemperature:

0°C ~ 85°C (TJ)
Category:

Embedded - FPGAs (Field Programmable Gate Array)
Datasheet:

XCV600-5BG560C.pdf

XCV600-5BG560C Frequently Asked Questions

Is XCV600-5BG560C currently in stock? ▼

FudongIC currently shows 3,743 units of XCV600-5BG560C in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for XCV600-5BG560C? ▼

The minimum order quantity currently shown for XCV600-5BG560C is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is XCV600-5BG560C original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for XCV600-5BG560C, please note this in your RFQ.

Can you provide a datasheet or technical support for XCV600-5BG560C? ▼

Yes. You can view or download the XCV600-5BG560C.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for XCV600-5BG560C, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for XCV600-5BG560C? ▼

Yes. Based on your application, preferred manufacturer, package 560-LBGA Exposed Pad, Metal, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for XCV600-5BG560C. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use XCV600-5BG560C? ▼

As a Embedded - FPGAs (Field Programmable Gate Array) product from AMD Xilinx, XCV600-5BG560C may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.