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SFV10R-2STE1HLF Amphenol ICC (FCI)

Part No.:: SFV10R-2STE1HLF

Manufacturer:: Amphenol ICC (FCI)

Category:: FFC, FPC (Flat Flexible) Connectors

Package:

Datasheet:: SFV10R-2STE1HLF.pdf

Description:: CONN FFC TOP 10POS 0.50MM R/A

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

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Application Scenarios

What Applications Is SFV10R-2STE1HLF Suitable For?

SFV10R-2STE1HLF is a FFC, FPC (Flat Flexible) Connectors product from Amphenol ICC (FCI), suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable FFC, FPC (Flat Flexible) Connectors components. Engineers can review the SFV10R-2STE1HLF datasheet, package and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Amphenol ICC (FCI) components are required, helping engineers evaluate SFV10R-2STE1HLF specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the SFV10R-2STE1HLF description, package and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports SFV10R-2STE1HLF datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for SFV10R-2STE1HLF Pricing & Technical Support

Product Overview

SFV10R-2STE1HLF is a FFC, FPC (Flat Flexible) Connectors product from Amphenol ICC (FCI). It is supplied in package and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide SFV10R-2STE1HLF datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: CONN FFC TOP 10POS 0.50MM R/A

Key Features

Part Number:SFV10R-2STE1HLF
Manufacturer:Amphenol ICC (FCI)
Category:FFC, FPC (Flat Flexible) Connectors
Package:
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

SFV10R-2STE1HLF may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for SFV10R-2STE1HLF stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

SFV-R
ProductStatus:

Active
FlatFlexType:

FFC, FPC
MountingType:

Surface Mount, Right Angle
Connector/ContactType:

Contacts, Top
NumberofPositions:

10
Pitch:

0.020 (0.50mm)
Termination:

Solder
FFCFCBThickness:

0.30mm
HeightAboveBoard:

0.071 (1.80mm)
LockingFeature:

Flip Lock
CableEndType:

Notched or Tabbed
ContactMaterial:

Phosphor Bronze
ContactFinish:

Tin
HousingMaterial:

Polyamide (PA), Nylon, Glass Filled, Halogen Free
ActuatorMaterial:

Polyphenylene Sulfide (PPS), Glass Filled, Halogen Free
Features:

Solder Retention, Zero Insertion Force (ZIF)
VoltageRating:

50V
OperatingTemperature:

-55°C ~ 105°C
Category:

FFC, FPC (Flat Flexible) Connectors
Datasheet:

SFV10R-2STE1HLF.pdf

SFV10R-2STE1HLF Frequently Asked Questions

Is SFV10R-2STE1HLF currently in stock? ▼

FudongIC currently shows 40,009 units of SFV10R-2STE1HLF in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for SFV10R-2STE1HLF? ▼

The minimum order quantity currently shown for SFV10R-2STE1HLF is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is SFV10R-2STE1HLF original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for SFV10R-2STE1HLF, please note this in your RFQ.

Can you provide a datasheet or technical support for SFV10R-2STE1HLF? ▼

Yes. You can view or download the SFV10R-2STE1HLF.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for SFV10R-2STE1HLF, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for SFV10R-2STE1HLF? ▼

Yes. Based on your application, preferred manufacturer, package , electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for SFV10R-2STE1HLF. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use SFV10R-2STE1HLF? ▼

As a FFC, FPC (Flat Flexible) Connectors product from Amphenol ICC (FCI), SFV10R-2STE1HLF may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.