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TCK302G,LF Toshiba Semiconductor and Storage

Part No.:: TCK302G,LF

Manufacturer:: Toshiba Semiconductor and Storage

Category:: PMIC - Power Distribution Switches, Load Drivers

Package:: 9-WCSP (1.5x1.5)

Datasheet:: TCK302G,LF.pdf

Description:: IC PWR SWITCH N-CHAN 1:1 9WCSP

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

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Application Scenarios

What Applications Is TCK302G,LF Suitable For?

TCK302G,LF is a PMIC - Power Distribution Switches, Load Drivers product from Toshiba Semiconductor and Storage, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable PMIC - Power Distribution Switches, Load Drivers components. Engineers can review the TCK302G,LF datasheet, package 9-WCSP (1.5x1.5) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original Toshiba Semiconductor and Storage components are required, helping engineers evaluate TCK302G,LF specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the TCK302G,LF description, package 9-WCSP (1.5x1.5) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports TCK302G,LF datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for TCK302G,LF Pricing & Technical Support

Product Overview

TCK302G,LF is a PMIC - Power Distribution Switches, Load Drivers product from Toshiba Semiconductor and Storage. It is supplied in package 9-WCSP (1.5x1.5) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide TCK302G,LF datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC PWR SWITCH N-CHAN 1:1 9WCSP

Key Features

Part Number:TCK302G,LF
Manufacturer:Toshiba Semiconductor and Storage
Category:PMIC - Power Distribution Switches, Load Drivers
Package:9-WCSP (1.5x1.5)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

TCK302G,LF may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for TCK302G,LF stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Tape & Reel (TR),Cut Tape (CT)
Series:

TCK30
ProductStatus:

Active
SwitchType:

General Purpose
NumberofOutputs:

1
Ratio-Input:Output:

1:1
OutputConfiguration:

High Side
OutputType:

N-Channel
Interface:

On/Off
Voltage-Load:

2.3V ~ 28V
Voltage-Supply(Vcc/Vdd):

Not Required
Current-Output(Max):

3A
RdsOn(Typ):

73mOhm
InputType:

-
Features:

Slew Rate Controlled, Status Flag
FaultProtection:

Over Temperature, Over Voltage, Reverse Current, UVLO
OperatingTemperature:

-40°C ~ 85°C (TA)
MountingType:

Surface Mount
Category:

PMIC - Power Distribution Switches, Load Drivers
Datasheet:

TCK302G,LF.pdf

TCK302G,LF Frequently Asked Questions

Is TCK302G,LF currently in stock? ▼

FudongIC currently shows 3,103 units of TCK302G,LF in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for TCK302G,LF? ▼

The minimum order quantity currently shown for TCK302G,LF is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is TCK302G,LF original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for TCK302G,LF, please note this in your RFQ.

Can you provide a datasheet or technical support for TCK302G,LF? ▼

Yes. You can view or download the TCK302G,LF.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for TCK302G,LF, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for TCK302G,LF? ▼

Yes. Based on your application, preferred manufacturer, package 9-WCSP (1.5x1.5), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for TCK302G,LF. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use TCK302G,LF? ▼

As a PMIC - Power Distribution Switches, Load Drivers product from Toshiba Semiconductor and Storage, TCK302G,LF may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.