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XCVU13P-3FSGA2577E AMD Xilinx

Part No.:: XCVU13P-3FSGA2577E

Manufacturer:: AMD Xilinx

Category:: Embedded - FPGAs (Field Programmable Gate Array)

Package:: 2577-BBGA, FCBGA

Datasheet:: XCVU13P-3FSGA2577E.pdf

Description:: IC FPGA 448 I/O 2577FCBGA

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is XCVU13P-3FSGA2577E Suitable For?

XCVU13P-3FSGA2577E is a Embedded - FPGAs (Field Programmable Gate Array) product from AMD Xilinx, suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable Embedded - FPGAs (Field Programmable Gate Array) components. Engineers can review the XCVU13P-3FSGA2577E datasheet, package 2577-BBGA, FCBGA and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original AMD Xilinx components are required, helping engineers evaluate XCVU13P-3FSGA2577E specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the XCVU13P-3FSGA2577E description, package 2577-BBGA, FCBGA and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports XCVU13P-3FSGA2577E datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for XCVU13P-3FSGA2577E Pricing & Technical Support

Product Overview

XCVU13P-3FSGA2577E is a Embedded - FPGAs (Field Programmable Gate Array) product from AMD Xilinx. It is supplied in package 2577-BBGA, FCBGA and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide XCVU13P-3FSGA2577E datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC FPGA 448 I/O 2577FCBGA

Key Features

Part Number:XCVU13P-3FSGA2577E
Manufacturer:AMD Xilinx
Category:Embedded - FPGAs (Field Programmable Gate Array)
Package:2577-BBGA, FCBGA
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

XCVU13P-3FSGA2577E may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for XCVU13P-3FSGA2577E stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Package/Case:

2577-BBGA, FCBGA
Packaging:

Tray
Series:

Virtex® UltraScale+™
ProductStatus:

Active
NumberofLABs/CLBs:

216000
NumberofLogicElements/Cells:

3780000
TotalRAMBits:

99090432
NumberofI/O:

448
NumberofGates:

-
Voltage-Supply:

0.873V ~ 0.927V
MountingType:

Surface Mount
OperatingTemperature:

0°C ~ 100°C (TJ)
Category:

Embedded - FPGAs (Field Programmable Gate Array)
Datasheet:

XCVU13P-3FSGA2577E.pdf

XCVU13P-3FSGA2577E Frequently Asked Questions

Is XCVU13P-3FSGA2577E currently in stock? ▼

FudongIC currently shows 3,840 units of XCVU13P-3FSGA2577E in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for XCVU13P-3FSGA2577E? ▼

The minimum order quantity currently shown for XCVU13P-3FSGA2577E is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is XCVU13P-3FSGA2577E original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for XCVU13P-3FSGA2577E, please note this in your RFQ.

Can you provide a datasheet or technical support for XCVU13P-3FSGA2577E? ▼

Yes. You can view or download the XCVU13P-3FSGA2577E.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for XCVU13P-3FSGA2577E, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for XCVU13P-3FSGA2577E? ▼

Yes. Based on your application, preferred manufacturer, package 2577-BBGA, FCBGA, electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for XCVU13P-3FSGA2577E. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use XCVU13P-3FSGA2577E? ▼

As a Embedded - FPGAs (Field Programmable Gate Array) product from AMD Xilinx, XCVU13P-3FSGA2577E may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.