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XRP2527IHB-1-F MaxLinear, Inc.

Part No.:: XRP2527IHB-1-F

Manufacturer:: MaxLinear, Inc.

Category:: PMIC - Power Distribution Switches, Load Drivers

Package:: 8-DFN (3x3)

Datasheet:: XRP2527IHB-1-F.pdf

Description:: IC PWR SWITCH USB 1:1 8TDFN

Quantity:: RFQ Add to RFQ List Buy Now Add to Cart

Unit Price:Request Quote

Total:Submit an RFQ for pricing

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Application Scenarios

What Applications Is XRP2527IHB-1-F Suitable For?

XRP2527IHB-1-F is a PMIC - Power Distribution Switches, Load Drivers product from MaxLinear, Inc., suitable for component selection in communications, automotive electronics, industrial control, cloud computing and smart-device projects.

5G Communications & Small-Cell Equipment

Suitable for 5G communications equipment, small-cell base stations and information platforms that require reliable PMIC - Power Distribution Switches, Load Drivers components. Engineers can review the XRP2527IHB-1-F datasheet, package 8-DFN (3x3) and stock availability to support component selection.

Automotive & ADAS Electronic Systems

Suitable for automotive, ADAS and vehicle-control systems where original MaxLinear, Inc. components are required, helping engineers evaluate XRP2527IHB-1-F specifications, pricing and supply lead time.

Industrial IoT & Automation Control

Suitable for industrial IoT, automation equipment, motor control and embedded-vision systems. Engineers can use the XRP2527IHB-1-F description, package 8-DFN (3x3) and technical specifications for BOM matching.

Cloud Computing & Data Center Platforms

Can be considered for cloud computing, data centers, server platforms and other high-reliability electronic systems. FudongIC supports XRP2527IHB-1-F datasheet lookup, stock confirmation, pricing requests and one-stop electronic component sourcing.

FudongIC has semiconductor distribution experience and works with global electronic component distributors and spot-stock suppliers in China, supporting component sourcing for 5G communications, aerospace and defense, automotive electronics, industrial control, medical electronics, energy and data-center applications.

Contact FudongIC for XRP2527IHB-1-F Pricing & Technical Support

Product Overview

XRP2527IHB-1-F is a PMIC - Power Distribution Switches, Load Drivers product from MaxLinear, Inc.. It is supplied in package 8-DFN (3x3) and can be considered for electronic systems where stability, reliability and supply continuity are important. FudongIC can provide XRP2527IHB-1-F datasheet lookup, stock confirmation, pricing requests, BOM sourcing and component-selection support.

Product Description: IC PWR SWITCH USB 1:1 8TDFN

Key Features

Part Number:XRP2527IHB-1-F
Manufacturer:MaxLinear, Inc.
Category:PMIC - Power Distribution Switches, Load Drivers
Package:8-DFN (3x3)
Supports datasheet lookup, stock confirmation and pricing requests
Suitable for samples, small production runs and volume sourcing requirements

Applications

XRP2527IHB-1-F may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.

Procurement & Technical Support

If you are looking for XRP2527IHB-1-F stock, volume pricing, lead time, alternative parts or technical documents, you can submit an RFQ through FudongIC. Our sales and technical teams can review your application, specification requirements, package needs and purchase quantity to provide a suitable sourcing option.

Packaging:

Bulk
Series:

-
ProductStatus:

Discontinued at Mosen
SwitchType:

USB Switch
NumberofOutputs:

1
Ratio-Input:Output:

1:1
OutputConfiguration:

High Side
OutputType:

-
Interface:

On/Off
Voltage-Load:

1.8V ~ 5.5V
Voltage-Supply(Vcc/Vdd):

Not Required
Current-Output(Max):

1A
RdsOn(Typ):

80mOhm
InputType:

Non-Inverting
Features:

Status Flag
FaultProtection:

Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
OperatingTemperature:

-40°C ~ 125°C (TJ)
MountingType:

Surface Mount
Category:

PMIC - Power Distribution Switches, Load Drivers
Datasheet:

XRP2527IHB-1-F.pdf

XRP2527IHB-1-F Frequently Asked Questions

Is XRP2527IHB-1-F currently in stock? ▼

FudongIC currently shows 2,410 units of XRP2527IHB-1-F in stock. Because electronic component inventory and pricing can change quickly, please submit an RFQ so we can confirm real-time stock, date code, unit price and lead time.

What is the minimum order quantity for XRP2527IHB-1-F? ▼

The minimum order quantity currently shown for XRP2527IHB-1-F is 1. For samples, small-batch orders, volume purchasing or long-term supply, submit an RFQ through FudongIC and we can provide tier pricing based on your actual requirements.

Is XRP2527IHB-1-F original and genuine? ▼

FudongIC has experience in semiconductor distribution and works with global electronic component distributors and spot-stock suppliers in China. We focus on supply-channel review, quality control and traceability. If you need authenticity documentation, date-code information or quality files for XRP2527IHB-1-F, please note this in your RFQ.

Can you provide a datasheet or technical support for XRP2527IHB-1-F? ▼

Yes. You can view or download the XRP2527IHB-1-F.pdf datasheet on this page. If you need pinout information, package details, BOM alternative suggestions or application-selection support for XRP2527IHB-1-F, you can also contact the FudongIC technical and sales team.

Can you recommend alternative parts for XRP2527IHB-1-F? ▼

Yes. Based on your application, preferred manufacturer, package 8-DFN (3x3), electrical specifications and lead-time requirements, FudongIC can help evaluate alternatives or related-series parts for XRP2527IHB-1-F. Please submit an RFQ with your original BOM or specification requirements.

Which applications and industries commonly use XRP2527IHB-1-F? ▼

As a PMIC - Power Distribution Switches, Load Drivers product from MaxLinear, Inc., XRP2527IHB-1-F may be used in projects involving 5G communications, aerospace and defense, automotive electronics, industrial IoT, wireless embedded vision, cloud computing, data centers, medical electronics, motor control, automation, energy and building technologies, subject to the requirements of the specific design.